As a company committed to delivering high-performance materials that simplify manufacturing and enhance device reliability, we proudly present our General-Purpose Thermal Adhesive. This all-in-one bonding and thermal management solution is engineered to meet the needs of modern electronics, industrial equipment, and precision assembly applications. With strong adhesion, excellent thermal conductivity, and stable long-term performance, it serves as a dependable partner for customers seeking both efficiency and durability.

1. Product Functions & Uses

Our General-Purpose Thermal Adhesive is designed to fulfill two core functions simultaneously: permanent structural bonding and effective heat dissipation. The adhesive provides robust adhesion between electronic components and heat-conductive surfaces, ensuring firm contact that enhances thermal transfer efficiency. It is widely used in attaching heat sinks, bonding power modules, fixing LEDs onto metal substrates, and securing internal components in high-temperature environments. Because the formula cures into a solid, thermally stable layer, it eliminates loose connections, reduces maintenance needs, and ensures consistent thermal performance over extended use.

Beyond electronics, the adhesive is also suitable for general industrial assembly where both thermal conduction and mechanical strength are required. Its versatility makes it ideal for both manual processes and automated production lines.

2. Product Features

Our thermal adhesive is formulated with a balanced blend of advanced polymer resins and thermally conductive fillers, providing a feature set aligned with modern engineering standards:

• High Thermal Conductivity: Ensures rapid heat transfer away from sensitive components, preventing overheating and improving overall device lifespan.
• Strong and Durable Bonding: Offers excellent adhesion to metals, ceramics, plastics, and various composite materials, creating a stable and vibration-resistant bond.
• Room-Temperature or Heat-Assisted Cure: Flexible curing options support different production scenarios and reduce process constraints.
• Electrical Insulation Safety: Provides a non-conductive interface to protect components from short circuits and ensure safe operation in high-voltage or sensitive circuits.
• Chemical and Aging Resistance: Maintains integrity when exposed to oils, solvents, humidity, and thermal cycling, ensuring long-term reliability even in demanding environments.
• Smooth Application & Minimal Shrinkage: The paste-like consistency supports controlled dispensing, uniform spreading, and bubble-free curing for consistent thermal performance.

3. Product Specifications

While we offer customizable formulas to fit specific project needs, our standard General-Purpose Thermal Adhesive typically includes the following specifications:

• Thermal Conductivity: 1.0–3.0 W/m·K
• Viscosity: 20,000–80,000 cps (depending on grade)

Curing Options:

Room-temperature cure: 4–24 hours

Heat cure (60–120°C): 20–60 minutes

• Hardness (Shore A/D): 60–80
• Dielectric Strength: >10 kV/mm
• Operating Temperature Range: –40°C to 150°C
• Color: Gray or white (custom colors available)
• Packaging: 50g syringes, 1kg cans, 20kg pails for industrial use

These specifications offer a balanced profile suitable for a wide range of production and maintenance applications.

4. Product Instructions

To achieve optimal bonding and thermal performance, we recommend the following application steps:

• Surface Preparation: Clean all bonding surfaces thoroughly to remove dust, oil, moisture, or oxidized layers. A clean surface ensures stronger adhesion and improved thermal contact.
• Dispensing & Application: Apply the adhesive evenly using a manual applicator, automated dispenser, or stencil. Uniform thickness helps maintain consistent thermal conductivity.
• Assembly & Positioning: Press the components together gently to eliminate gaps or trapped air. Ensure proper alignment before the adhesive begins to cure.
• Curing Process: Allow the adhesive to cure fully according to the selected curing method (room temperature or heat-assisted). Avoid moving the parts during the curing stage.
• Post-Cure Verification: After curing, verify adhesion strength and thermal contact. The final bonded interface should form a firm, stable, and thermally efficient layer.

5. Applicable Industries

Our General-Purpose Thermal Adhesive is engineered to support a broad range of industries where both mechanical bonding and heat dissipation are critical. These include:

• Electronics Manufacturing (PCBs, power modules, MOSFETs, IGBTs)
• LED Lighting (streetlights, signage, high-intensity fixtures)
• Telecommunications Equipment (routers, base station modules)
• Automotive and EV Systems (battery packs, control units, sensors)
• Industrial Automation (motor drivers, industrial controllers)
• Consumer Devices (laptops, gaming hardware, smart appliances)
• Energy Systems (inverters, solar controllers, power supplies)

Its adaptability and stability make it a preferred bonding solution across high-performance and mass-production environments.

6. Target Customers

We provide this product to customers who require dependable thermal management materials and reliable adhesive performance. Our target users include:

• Electronics manufacturers seeking improved thermal solutions for high-power devices.
• LED module and lighting manufacturers needing stable adhesive for metal substrate bonding.
• Automotive and EV suppliers focused on safety and heat dissipation in compact assemblies.
• OEM/ODM factories requiring consistent adhesive quality for automated production lines.
• Engineering firms and maintenance teams handling equipment repair, retrofits, and thermal component replacement.
• R&D labs and prototyping teams needing versatile adhesives for testing and small-batch builds.

Our product is tailored for professionals who value reliability, consistency, and performance in demanding thermal environments.